An electronic radiator is a device that accelerates the heat dissipation of the heating body. There are two points to measure the quality of a radiator: heat dissipation and quietness. Integrated circuits are used extensively in computer components. As we all know, high temperature is the enemy of integrated circuits. High temperature will not only cause the system to run erratically, shorten the service life, and may even cause some components to burn out. The heat that causes the high temperature does not come from outside the computer, but from inside the computer, or inside the integrated circuit. The function of the electronic radiator is to absorb the heat, and then dissipate it to the inside or outside of the case to ensure that the temperature of the computer components is normal. Most radiators absorb heat by contacting the surface of the heat-generating components, and then transfer the heat to a distance through various methods, such as the air in the chassis, and then the chassis transmits the hot air to the outside of the chassis to complete the heat dissipation of the computer.
Surface Quality Requirements for Radiators
1.1 The surface of the heat sink should be free from defects such as shrinkage cavities, rust, cracks, etc.;
1.2 The metal fasteners (pressing plate, gland, disc spring) of the flat radiator and the conductive sheet of the water-cooling radiator should be protected by plating;
1.3 The maximum allowable value of the surface roughness Ra of the heat sink table is 3.2, m;
1.4 The flatness of the heat sink table should not be lower than grade 9;
1.5 The radiator (including heat sinks, fasteners and insulating parts) used for power semiconductor devices in the wet tropical zone should be protected on the surface, and its moisture resistance, salt spray resistance and mold resistance should be in line with the corresponding tropical power semiconductor devices. standard;
1.6 The fasteners and insulating parts specially used for radiators shall comply with GBB446.3 (heat sink insulating parts and fasteners for power semiconductor devices)
1.7 The tightening torque or tightening pressure of the radiator and power semiconductor installation shall comply with the relevant provisions of the device product standard;
1.8 The size of the installation center positioning pin of the plate-shaped heat sink table top: 2.5mm in diameter, 1mmo above the table top
Requirements for use of environmental conditions
2.1 There should be certain requirements for the water quality of the cooling water, the resistivity of the circulating water should not be lower than 2.5Ki2, the PH value should be between 6}9; the inlet water temperature should not be higher than 35℃, and the water flow should be 4-8L/min;
2.2 When used for
Agricultural machinery Parts high voltage or higher voltage devices, the above water quality requirements or higher water quality requirements must be ensured;
2.3 When the water-cooled radiator is working, special attention should be paid to preventing water leakage, blocking and condensation.
2.4 When installing the air-cooled radiator, the radiator blades should be in the direction of the cooling air flow; the inlet air temperature should not be higher than 400C, and the wind speed at the inlet end should be 4-6mls;
2.5 Since the air-cooled radiator has the characteristics of wind resistance parameters, when selecting the radiator in the whole machine, the relationship between the thermal resistance, flow resistance and wind speed of the radiator should be checked according to the load requirements and fan capacity, and the thermal resistance of the radiator and the wind speed should be comprehensively considered. Two parameters of wind resistance.
Harm and identification of inferior radiators
There are a large number of low-quality and low-quality radiators on the market. This radiator has a big gap with the national industry standards in terms of heat sink material, processing requirements, and component quality. It has a great impact on the quality of the whole machine. Users can be identified from the following aspects when choosing:
3.1 The quality of the material (purity, thickness, machining accuracy, etc.) and manufacturing process (cracks, shrinkage holes, etc. caused by casting), inferior materials and rough and defective processes will directly affect the thermal conductivity of the radiator;
3.2 The surface roughness and flatness of the contact surface of the heat sink directly affect the contact thermal resistance and pressure drop;
3.3 Disc springs for radiators should ensure that the free height should be stable after 24 hours of flattening, otherwise the springs may fail after a period of use, resulting in poor contact between the radiator and the die.
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